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2.0mm PCB & CCL SUS301H Ultra-Thin Lamination Press Plate for PCB or CCL laminator
제품 상세 정보:
| 원래 장소: | 중국 |
| 브랜드 이름: | MK |
| 모델 번호: | MKSP-S630T |
결제 및 배송 조건:
| 최소 주문 수량: | 50개 |
|---|---|
| 가격: | negotiable |
| 포장 세부 사항: | 내부에 적절한 부드러운 보호 재료가 포함된 견고한 합판 패키지로 해상 또는 항공 운송을 위한 장거리 운송에 적합합니다. |
| 배달 시간: | 10-20 영업일 |
| 지불 조건: | L/C, D/A, D/P, T/T, 서부 동맹 |
| 공급 능력: | 한 달에 10000 평방 미터 |
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상세 정보 |
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| 원료: | 프리미엄 수입 SUS301H 스테인레스 스틸 | 표준두께: | 0.5mm / 1.0mm / 1.2mm 초박형 맞춤형 게이지 |
|---|---|---|---|
| 애플리케이션: | PCB 인쇄 회로 기판 및 CCL 동박 적층판용 전문 적층 지지판 | 표준 크기(L*W mm): | 1500*1295, 1300*800, 1295*787, 1295*1613, 1295*1143, 1285*750, 1280*1120mm 등 |
| 제품명: | PCB & CCL SUS301H 초박형 라미네이션 프레스 플레이트 | L/W 크기 공차: | ± 1mm |
| 강조하다: | 2.0mm PCB lamination press plate,ultra-thin CCL SUS301H plate,PCB laminator press plate |
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제품 설명
Product Overview
MKSP-S301 ultra-thin lamination press plate is manufactured with high-quality imported German and Japanese SUS301H stainless steel materials. Featuring ultra-thin design and stable, reliable lamination performance, this cost-effective solution is optimized for PCB and CCL mass production lamination processes.
The ultra-thin structural design enables more stacking layers during each lamination cycle, significantly boosting production throughput. It reduces interlayer temperature differences inside the laminator, stabilizes board thermal expansion and contraction, and eliminates copper plate wrinkling defects caused by uneven heat conduction.
Universally compatible with all mainstream lamination steel plate washing machines, this product delivers high adaptability for diverse production scenarios.
Standard Sizes
PCB Lamination Press Plate (L × W, mm)
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
CCL Lamination Press Plate (L × W, mm)
1910×1270, 2210×1270, 2220×1270
Premium SUS301H Ultra-Thin Press Plate | High Productivity, Stable Lamination, Anti-Wrinkle Solution for PCB & CCL Manufacturing
Core Product Advantages
- Raw Material: Premium imported SUS301H stainless steel (German/Japanese raw material) with high rigidity and durability
- Standard Thickness: 0.5mm / 1.0mm / 1.2mm ultra-thin customized gauge
- Production Optimization: Supports more lamination stacking layers to effectively improve production capacity; reduces interlayer temperature difference to stabilize board size tolerance
- Thermal Performance: Excellent thermal conductivity and stable thermal expansion coefficient, completely solving copper plate wrinkling problems
- Equipment Compatibility: Fully adaptable to all types of industrial lamination steel plate washing machines
- Application Scenarios: Professional lamination supporting plate for PCB printed circuit boards and CCL copper clad laminates
- Cost Performance: Reliable industrial-grade quality with competitive pricing and lower comprehensive production cost
Performance Parameters
| Parameter | SUS630T Mass-Lam Plate | SUS630T Pin-lam Plate |
|---|---|---|
| Thickness | 1.0-2.0mm | 1.0-2.0mm |
| Width | ≤1300 | ≤1300 |
| Length | ≤2410 | ≤2410 |
| Thickness tolerance | ±0.10 | ±0.10 |
| Surface roughness (um) | Ra≤0.15 Rz≤1.5 | Ra≤0.15 Rz≤1.5 |
| Positioning hole to hole tolerance | -- | +/-0.10 |
| Standard bushing slot tolerance | -- | +0.10/-0mm |
| Warpage degree | ≤3mm/M | ≤3mm/M |
| L/W size tolerance | ±1mm | ±1mm |
| Yield strength | ≥1175 N/mm² | ≥1175 N/mm² |
| Tensile strength | ≥1400 N/mm² | ≥1400 N/mm² |
| Extensibility | ≥5% | ≥5% |
| Hardness HRC | 50HRC±2 | 50HRC±2 |
| Work temperature | ≤400℃ | ≤400℃ |
| Parallelism | ≤0.03 | ≤0.03 |
| Diagonal deviation | 1-2mm | 1-2mm |
| Thermal conductivity | ≥18W/MK at 300℃ | ≥18W/MK at 300℃ |
| Average thermal expansion coefficient (10⁻⁶/℃) | 10~12 | 10~12 |
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