• PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
  • PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
  • PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production

PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production

제품 상세 정보:

원래 장소: 중국
브랜드 이름: MK
모델 번호: MKSP-S630T

결제 및 배송 조건:

최소 주문 수량: 50개
가격: negotiable
포장 세부 사항: 내부에 적절한 부드러운 보호 재료가 포함된 견고한 합판 패키지로 해상 또는 항공 운송을 위한 장거리 운송에 적합합니다.
배달 시간: 10-20 영업일
지불 조건: L/C, D/A, D/P, T/T, 서부 동맹
공급 능력: 한 달에 10000 평방 미터
최고의 가격 접촉

상세 정보

원료: 고품질 국산 SUS630T 스테인레스 스틸 표준두께: 1.0-2.0mm
최대 너비: ≤1300mm 최대 길이: ≤2410mm
제품명: PCB & CCL SUS630T 라미네이션 프레스 플레이트 표면 거칠기: Ra≤0.15μm, Rz≤1.5μm
강조하다:

SUS630T high-hardness lamination press plate

,

high-temperature resistant steel plate for PCB

,

corrosion resistant CCL production steel plate

제품 설명

PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate
MKSP-S630T high-precision lamination press plate utilizes premium domestic SUS630T stainless steel materials, delivering stable and reliable lamination performance with superior cost competitiveness. This specialized lamination steel plate for PCB and CCL production features exceptional thermal performance, high hardness, and outstanding corrosion resistance.
Product Advantages
SUS630T High-Hardness Lamination Press Plate | High Precision, High Temperature Resistance, Energy-Saving & Cost-Effective Solution for PCB & CCL Lamination
Feature Specification & Benefits
Raw Material High-quality domestic SUS630T stainless steel with mature, stable material formula
Cost Performance Reliable industrial-grade lamination quality with highly competitive pricing
Thermal Performance Excellent thermal conductivity and stable thermal expansion coefficient for significant energy and cost savings
Material Performance High hardness up to 50HRC±2, excellent corrosion resistance and mechanical stability
Equipment Compatibility Universally compatible with all types of industrial lamination steel plate washing machines
Application Scenarios Professional high-precision press plate for PCB printed circuit board and CCL copper clad laminate lamination processes
Standard Sizes
PCB Lamination Press Plate (L × W, mm):
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
CCL Lamination Press Plate (L × W, mm):
1910×1270, 2210×1270, 2220×1270
Detailed Performance Parameters
Performance Parameter Mass-Lam Plate (SUS630T) Pin-Lam Plate (SUS630T)
Thickness 1.0-2.0mm 1.0-2.0mm
Max Width ≤1300mm ≤1300mm
Max Length ≤2410mm ≤2410mm
Thickness Tolerance ±0.10mm ±0.10mm
Surface Roughness Ra≤0.15μm, Rz≤1.5μm Ra≤0.15μm, Rz≤1.5μm
Positioning Hole Tolerance -- ±0.10mm
Standard Bushing Slot Tolerance -- 0 ~ +0.10mm
Warpage Degree ≤3mm/M ≤3mm/M
Length & Width Tolerance ±1mm ±1mm
Yield Strength ≥1175 N/mm² ≥1175 N/mm²
Tensile Strength ≥1400 N/mm² ≥1400 N/mm²
Extensibility ≥5% ≥5%
Hardness 50HRC±2 50HRC±2
Max Working Temperature ≤400℃ ≤400℃
Parallelism ≤0.03mm ≤0.03mm
Diagonal Deviation 1-2mm 1-2mm
Thermal Conductivity (@300℃) ≥18W/MK ≥18W/MK
Average Thermal Expansion Coefficient 10~12 (10⁻⁶/℃) 10~12 (10⁻⁶/℃)
PCB Lamination Steel Plate - High precision manufacturing process
SUS630T Lamination Press Plate for circuit board production

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